1. 2. 3. material content data sheet sales product name tle8201r issued 28. august 2013 ma# MA000694392 package pg-dso-36-27 weight* 2054.03 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 19.895 0.97 0.97 9686 9686 leadframe inorganic material phosphorus 7723-14-0 0.383 0.02 187 non noble metal zinc 7440-66-6 1.533 0.07 746 non noble metal iron 7439-89-6 30.652 1.49 14923 non noble metal copper 7440-50-8 1244.598 60.59 62.17 605931 621787 wire noble metal gold 7440-57-5 9.092 0.44 0.44 4426 4426 encapsulation organic material carbon black 1333-86-4 1.435 0.07 698 plastics epoxy resin - 65.994 3.21 32129 inorganic material silicondioxide 60676-86-0 649.895 31.64 34.92 316401 349228 leadfinish non noble metal tin 7440-31-5 16.150 0.79 0.79 7863 7863 plating noble metal silver 7440-22-4 0.741 0.04 0.04 361 361 solder noble metal silver 7440-22-4 0.205 0.01 100 non noble metal tin 7440-31-5 0.137 0.01 66 non noble metal lead 7439-92-1 13.316 0.65 0.67 6483 6649 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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